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1

[IEEE 2006 International Electron Devices Meeting - San Francisco, CA, USA (2006.12.11-2006.12.13)] 2006 International Electron Devices Meeting - Plasma Co-polymerization Technology with Molecular-level Structure Tightening in "In-situ" SiOCH Stacks for 32nm-node Cu Interconnects

Tada, M., Yamamoto, H., Ito, F., Narihiro, M., Ueki, M., Inoue, N., Abe, M., Saito, S., Takeuchi, T., Furutake, N., Onodera, T., Kawahara, J., Arai, K., Kasama, Y., Taiji, T., Tohara, M., Sekine, M.,

Year:

2006

Language:

english

File:

PDF, 436 KB

english, 2006

2

Robust porous SiOCH/Cu interconnects with ultrathin sidewall protection liners

Tada, M., Tamura, T., Ito, F., Ohtake, H., Narihiro, M., Tagami, M., Ueki, M., Hijioka, K., Abe, M., Inoue, N., Takeuchi, T., Saito, S., Onodera, T., Furutake, N., Arai, K., Sekine, M., Suzuki, M., Ha

Journal:

IEEE Transactions on Electron Devices

Year:

2006

Language:

english

File:

PDF, 1.10 MB

english, 2006

3

Improving Reliability of Copper Dual-Damascene Interconnects by Impurity Doping and Interface Strengthening

Tada, M., Abe, M., Furutake, N., Ito, F., Tonegawa, T., Sekine, M., Hayashi, Y.

Journal:

IEEE Transactions on Electron Devices

Year:

2007

Language:

english

File:

PDF, 1.61 MB

english, 2007

4

[IEEE Digest of Technical Papers. 2004 Symposium on VLSI Technology, 2004. - Honolulu, HI, USA (2004.06.17-2004.06.17)] Digest of Technical Papers. 2004 Symposium on VLSI Technology, 2004. - Highly reliable, 65 nm-node Cu dual damascene interconnects with full porous-SiOCH (k=2.5) films for low-power ASICs

Ueki, M., Narihiro, M., Ohtake, H., Tagami, M., Tada, M., Ito, F., Harada, Y., Abe, M., Inoue, N., Arai, K., Takeuchi, T., Saito, S., Onodera, T., Furutake, N., Hiroi, M., Sekine, M., Hayashi, Y.

Year:

2004

Language:

english

File:

PDF, 204 KB

english, 2004

5

[IEEE 2009 IEEE International Interconnect Technology Conference - IITC - Sapporo, Japan (2009.06.1-2009.06.3)] 2009 IEEE International Interconnect Technology Conference - Highly-reliable molecular-pore-stack (MPS)-SiOCH/Cu interconnects with CoWB metal-cap films

Tagami, M., Furutake, N., Inoue, N., Nakazawa, E., Arita, K., Hayashi, Y.

Year:

2009

Language:

english

File:

PDF, 1.57 MB

english, 2009

6

[IEEE Digest of Technical Papers. 2005 Symposium on VLSI Technology, 2005. - Kyoto, Japan (June 14-16, 2005)] Digest of Technical Papers. 2005 Symposium on VLSI Technology, 2005. - Feasibility study of a novel molecular-pore-stacking (MPS), SiOCH film in fully-scale-down, 45nm-node Cu damascene interconnects

Tada, M., Ohtake, H., Narihiro, M., Ito, F., Taiji, T., Tohara, M., Motoyama, K., Kasama, Y., Tagami, M., Abe, M., Takeuchi, T., Arai, K., Saito, S., Furutake, N., Onodera, T., Kawahara, J., Kinoshita

Year:

2005

Language:

english

File:

PDF, 654 KB

english, 2005

7

[IEEE 2006 Symposium on VLSI Technology, 2006. Digest of Technical Papers. - Honolulu, HI, USA (June 13-15, 2006)] 2006 Symposium on VLSI Technology, 2006. Digest of Technical Papers. - High-Performance Cu-Interconnects with Novel Seamless Low-k SiOCH Stacks (SEALS) Featured by Compositional Modulation Process for 45nm-Node ULSI Devices

Tagami, M., Ohtake, H., Tada, M., Ueki, M., Ito, F., Taiji, T., Kasama, Y., Iwamoto, T., Wakabayashi, H., Fukai, T., Arai, K., Saito, S., Yamamoto, H., Abe, M., Narihiro, M., Furutake, N., Onodera, T.

Year:

2006

Language:

english

File:

PDF, 790 KB

english, 2006

8

[IEEE 2008 IEEE International Electron Devices Meeting (IEDM) - San Francisco, CA, USA (2008.12.15-2008.12.17)] 2008 IEEE International Electron Devices Meeting - RF performance boosting for 40nm-node CMOS device by low-k/Cu dual damascene contact

Kawahara, J., Hijioka, K., Kume, I., Nagase, H., Tanabe, A., Ueki, M., Yamamoto, H., Ito, F., Inoue, N., Tagami, M., Furutake, N., Onodera, T., Saito, S., Takeuchi, T., Fukai, T., Asada, M, Arita, K.,

Year:

2008

Language:

english

File:

PDF, 701 KB

english, 2008

9

[IEEE 2008 IEEE International Electron Devices Meeting (IEDM) - San Francisco, CA, USA (2008.12.15-2008.12.17)] 2008 IEEE International Electron Devices Meeting - High performance Cu interconnects with damage-less full molecular-pore-stack (MPS) SiOCH for 32nm-node LSIs and beyond

Ueki, M., Tagami, M., Ito, F., Kume, I., Yamamoto, H., Kawahara, J., Inoue, N., Hijioka, K., Takeuchi, T., Saito, S., Onodera, T., Furutake, N., Okada, N., Hayashi, Y.

Year:

2008

Language:

english

File:

PDF, 981 KB

english, 2008

10

Comprehensive Chemistry Designs in Porous SiOCH Film Stacks and Plasma Etching Gases for Damageless Cu Interconnects in Advanced ULSI Devices

Hayashi, Y., Ohtake, H., Kawahara, J., Tada, M., Saito, S., Inoue, N., Ito, F., Tagami, M., Ueki, M., Furutake, N., Takeuchi, T., Yamamoto, H., Abe, M.

Journal:

IEEE Transactions on Semiconductor Manufacturing

Year:

2008

Language:

english

File:

PDF, 2.39 MB

english, 2008

11

[IEEE Proceedings of the IEEE 2001 International Interconnect Technology Conference - Burlingame, CA, USA (2001.06.6-2001.06.6)] Proceedings of the IEEE 2001 International Interconnect Technology Conference (Cat. No.01EX461) - Dual hard mask process for low-k porous organosilica dielectric in copper dual damascene interconnect fabrication

Hiroi, M., Tada, M., Ohtake, H., Saito, S., Onodera, T., Furutake, N., Harada, Y., Hayashi, Y.

Year:

2001

Language:

english

File:

PDF, 344 KB

english, 2001

12

[IEEE IEEE International Electron Devices Meeting 2003 - Washington, DC, USA (8-10 Dec. 2003)] IEEE International Electron Devices Meeting 2003 - A 65nm-node, Cu interconnect technology using porous SiOCH film (k=2.5) covered with ultra-thin, low-k pore seal (k=2.7)

Tada, M., Harada, Y., Tamura, T., Inoue, N., Ito, F., Yoshiki, M., Ohtake, H., Narihiro, M., Tagami, M., Ueki, M., Hijioka, K., Abe, M., Takeuchi, T., Saito, S., Onodera, T., Furutake, N., Arai, K., F

Year:

2003

Language:

english

File:

PDF, 292 KB

english, 2003

13

[IEEE IEEE InternationalElectron Devices Meeting, 2005. IEDM Technical Digest. - Tempe, Arizon, USA (Dec. 5, 2005)] IEEE InternationalElectron Devices Meeting, 2005. IEDM Technical Digest. - A robust 45 nm-node, dual damascene interconnects with high quality cu/barrier interface by a novel oxygen absorption process

Abe, M., Tada, M., Ohtake, H., Furutake, N., Narihiro, M., Arai, K., Takeuchi, T., Saito, S., Taiji, T., Motoyama, K., Kasama, Y., Arita, K., Ito, F., Yamamoto, H., Tagami, M., Tonegawa, T., Tsuchiya,

Year:

2005

Language:

english

File:

PDF, 1.46 MB

english, 2005

14

Chemical Structure Effects of Ring-Type Siloxane Precursors on Properties of Plasma-Polymerized Porous SiOCH Films

Tada, Munehiro, Yamamoto, Hironori, Ito, Fuminori, Takeuchi, Tsuneo, Furutake, Naoya, Hayashi, Yoshihiro

Journal:

Journal of The Electrochemical Society

Year:

2007

Language:

english

File:

PDF, 1.13 MB

english, 2007

15

Obstructive jaundice caused by a portal cavernoma

Masato Takamatsu, Masayuki Furutake, Takeshi Hisa, Mizuho Ueda

Journal:

Japanese Journal of Radiology

Year:

2010

Language:

english

File:

PDF, 366 KB

english, 2010

16

ENDOSCOPIC NECROSECTOMY UNDER DIRECT VISION AFTER ENDOSCOPIC ULTRASOUND-GUIDED CYSTGASTROSTOMY FOR ORGANIZED PANCREATIC NECROSIS

Takeshi Hisa, Masaki Tanaka, Hiroki Ohkubo, Masayuki Furutake, Masato Takamatsu

Journal:

Digestive Endoscopy

Year:

2008

Language:

english

File:

PDF, 462 KB

english, 2008

17

Effects of Ti addition on via reliability in Cu dual damascene interconnects

Ueki, M., Hiroi, M., Ikarashi, N., Onodera, T., Furutake, N., Inoue, N., Hayashi, Y.

Journal:

IEEE Transactions on Electron Devices

Year:

2004

Language:

english

File:

PDF, 1.79 MB

english, 2004

18

PZT MIM capacitor with oxygen-doped Ru-electrodes for embedded FeRAM devices

Inoue, N., Furutake, N., Toda, A., Tada, M., Hayashi, Y.

Journal:

IEEE Transactions on Electron Devices

Year:

2005

Language:

english

File:

PDF, 1.32 MB

english, 2005

19

Feasibility Study of 45-nm-Node Scaled-Down Cu Interconnects With Molecular-Pore-Stacking (MPS) SiOCH Films

Tada, M., Ohtake, H., Ito, F., Narihiro, M., Taiji, T., Kasama, Y., Takeuchi, T., Arai, K., Furutake, N., Oda, N., Sekine, M., Hayashi, Y.

Journal:

IEEE Transactions on Electron Devices

Year:

2007

Language:

english

File:

PDF, 1.36 MB

english, 2007

20

Robust Low Oxygen Content Cu Alloy for Scaled-Down ULSI Interconnects Based on Metallurgical Thermodynamic Principles

Hayashi, Y., Abe, M., Tada, M., Narihiro, M., Tagami, M., Ueki, M., Inoue, N., Ito, F., Yamamoto, H., Takeuchi, T., Saito, S., Onodera, T., Furutake, N.

Journal:

IEEE Transactions on Electron Devices

Year:

2009

Language:

english

File:

PDF, 1.29 MB

english, 2009

21

Intraductal carcinoma with complex fusion of tubular glands without macroscopic mucus in main pancreatic duct: Dilemma in classification

Takeshi Hisa, Bunsei Nobukawa, Koichi Suda, Hiroki Ohkubo, Satoshi Shiozawa, Hiroki Ishigame, Masato Takamatsu, Masayuki Furutake

Journal:

Pathology International

Year:

2007

Language:

english

File:

PDF, 434 KB

english, 2007

22

Mucinous cystadenoma of the pancreas with huge mural hematoma

Takeshi Hisa, Hiroki Ohkubo, Satoshi Shiozawa, Hiroki Ishigame, Mizuho Ueda, Masato Takamatsu, Masayuki Furutake

Journal:

Pathology International

Year:

2009

Language:

english

File:

PDF, 578 KB

english, 2009

23

Lymphoplasmacytic granuloma localized to the ampulla of Vater: an ampullary lesion of IgG4-related systemic disease?

Takeshi Hisa, Hiroki Ohkubo, Satoshi Shiozawa, Hiroki Ishigame, Masayuki Furutake, Masato Takamatsu

Journal:

Gastrointestinal Endoscopy

Year:

2008

Language:

english

File:

PDF, 516 KB

english, 2008

24

[IEEE International Electron Devices Meeting. IEDM Technical Digest - Washington, DC, USA (7-10 Dec. 1997)] International Electron Devices Meeting. IEDM Technical Digest - A novel vertical current limiter fabricated with a deep trench forming technology for highly reliable field emitter arrays

Takemura, H., Tomihari, Y., Furutake, N., Matsuno, F., Yoshiki, M., Takada, N., Okamoto, A., Miyano, S.

Year:

1997

Language:

english

File:

PDF, 592 KB

english, 1997

25

Endoscopic ultrasound-guided antegrade stone removal in a patient with pancreatic stones and anastomotic stricture after end-to-side pancreaticojejunostomy

Hisa, Takeshi, Momoi, Tamaki, Shimizu, Takehiro, Furutake, Masayuki, Takamatsu, Masato, Ohkubo, Hiroki

Journal:

Year:

2013

Language:

english

File:

PDF, 816 KB

english, 2013

26

[IEEE 2012 IEEE International Electron Devices Meeting (IEDM) - San Francisco, CA, USA (2012.12.10-2012.12.13)] 2012 International Electron Devices Meeting - High on/off-ratio P-type oxide-based transistors integrated onto Cu-interconnects for on-chip high/low voltage-bridging BEOL-CMOS I/Os

Sunamura, H., Kaneko, K., Furutake, N., Saito, S., Narihiro, M., Ikarashi, N., Hane, M., Hayashi, Y.

Year:

2012

Language:

english

File:

PDF, 487 KB

english, 2012

27

[IEEE 2007 IEEE International Interconnect Technology Conferencee - Burlingame, CA, USA (2007.06.4-2007.06.6)] 2007 IEEE International Interconnect Technology Conferencee - 45nm-node Interconnects with Porous SiOCH-Stacks, Tolerant of Low-Cost Packaging Applications

Inoue, N., Tagami, M., Itoh, F., Yamamoto, H., Takeuchi, T., Saito, S., Furutake, N., Ueki, M., Tada, M., Suzuki, T., Hayashi, Y.

Year:

2007

Language:

english

File:

PDF, 880 KB

english, 2007

28

[IEEE Proceedings of the IEEE 2006 International Interconnect Technology Conference - Burlingame, CA (2006.06.5-2006.06.7)] 2006 International Interconnect Technology Conference - High Performance High-k MIM Capacitor with Plug-in Plate (PiP) for Power Delivery Line Hige-Speed MPUs

Inoue, N., Ohtake, H., Kume, I., Furutake, N., Onodera, T., Saito, S., Tanabe, A., Tagami, M., Tada, M., Hayashi, Y.

Year:

2006

Language:

english

File:

PDF, 638 KB

english, 2006

29

[IEEE 2012 IEEE Symposium on VLSI Technology - Honolulu, HI, USA (2012.06.12-2012.06.14)] 2012 Symposium on VLSI Technology (VLSIT) - Operation of functional circuit elements using BEOL-transistor with InGaZnO channel for on-chip high/low voltage bridging I/Os and high-current switches

Kaneko, K., Sunamura, H., Narihiro, M., Saito, S., Furutake, N., Hane, M., Hayashi, Y.

Year:

2012

Language:

english

File:

PDF, 322 KB

english, 2012

30

[IEEE Eleventh International Vacuum Microelectronics Conference. IVMC'98 - Asheville, NC, USA (19-24 July 1998)] Eleventh International Vacuum Microelectronics Conference. IVMC'98 (Cat. No.98TH8382) - A novel field emitter array technology for sub-half-micron diameter gates

Yoshiki, M., Furutake, N., Takemura, H., Okamoto, A., Miyano, S.

Year:

1998

Language:

english

File:

PDF, 164 KB

english, 1998

31

[IEEE 2009 IEEE International Electron Devices Meeting (IEDM) - Baltimore, MD, USA (2009.12.7-2009.12.9)] 2009 IEEE International Electron Devices Meeting (IEDM) - RF performance upgrading of low-power 40nm-node CMOS devices by extremely low-resistance partially-thickened local (PTL)-interconnects

Hijioka, K., Kawahara, J., Narihiro, M., Kume, I., Tanabe, A., Nagase, H., Yamamoto, H., Inoue, N., Takeuchi, T., Onodera, T., Saito, S., Furutake, N., Hayashi, Y.

Year:

2009

Language:

english

File:

PDF, 647 KB

english, 2009

32

[IEEE 2011 Materials for Advanced Metallization (MAM) - Dresden, Germany (2011.05.8-2011.05.12)] 2011 IEEE International Interconnect Technology Conference - Effects of metal-cap coverage on electro-migration (EM) tolerance for scaled-down Cu interconnects

Ueki, M., Nakazawa, E., Kitao, R., Hiroshima, S., Kurokawa, T., Furutake, N., Yamamoto, H., Inoue, N., Tsuchiya, Y., Hayashi, Y.

Year:

2011

Language:

english

File:

PDF, 409 KB

english, 2011

33

[Japan Soc. Appl. Phys 2001 Symposium on VLSI Technology. Digest of Technical Papers - Kyoto, Japan (12-14 June 2001)] 2001 Symposium on VLSI Technology. Digest of Technical Papers (IEEE Cat. No.01 CH37184) - Barrier-metal-free (BMF), Cu dual-damascene interconnects with Cu-epi-contacts buried in anti-diffusive, low-k organic film

Tada, M., Ohtake, H., Harada, Y., Hiroi, M., Saito, S., Onodera, T., Furutake, N., Kawahara, J., Tagami, M., Kinoshita, K., Fukai, T., Mogami, T., Hayashi, Y.

Year:

2001

Language:

english

File:

PDF, 415 KB

english, 2001

34

[IEEE 2008 Symposium on VLSI Technology - Honolulu, HI, USA (2008.06.17-2008.06.19)] 2008 Symposium on VLSI Technology - A new direct low-k/Cu dual damascene (DD) contact lines for low-loss (LL) CMOS device platforms

Kawahara, J., Ueki, M., Tagami, M., Yako, K., Yamamoto, H., Ito, F., Nagase, H., Saito, S., Furutake, N., Onodera, T., Takeuchi, T., Nakamura, H., Arita, K., Motoyama, K., Nakazawa, E., Fujii, K., Sek

Year:

2008

Language:

english

File:

PDF, 1.29 MB

english, 2008

35

Magnetic resonance fetal right lung volumetry and its efficacy in predicting postnatal short-term outcomes of congenital left-sided diaphragmatic hernia

Hidaka, Nobuhiro, Ishii, Keisuke, Furutake, Yoko, Yamamoto, Ryo, Sasahara, Jun, Mitsuda, Nobuaki

Journal:

Journal of Obstetrics and Gynaecology Research

Year:

2014

Language:

english

File:

PDF, 700 KB

english, 2014

36

[IEEE 2008 International Interconnect Technology Conference - IITC - Burlingame, CA, USA (2008.06.1-2008.06.4)] 2008 International Interconnect Technology Conference - Highly-Reliable Low-Resistance Cu Interconnects with PVD-Ru/Ti Barrier Metal toward Automotive LSIs

Tagami, M., Furutake, N., Saito, S., Hayashi, Y.

Year:

2008

Language:

english

File:

PDF, 805 KB

english, 2008

37

[IEEE 2014 IEEE Symposium on VLSI Technology - Honolulu, HI, USA (2014.6.9-2014.6.12)] 2014 Symposium on VLSI Technology (VLSI-Technology): Digest of Technical Papers - Enhanced drivability of high-Vbd dual-oxide-based complementary BEOL-FETs for compact on-chip pre-driver applications

Sunamura, H., Inoue, N., Furutake, N., Saito, S., Narihiro, M., Hane, M., Hayashi, Y.

Year:

2014

Language:

english

File:

PDF, 748 KB

english, 2014

38

[IEEE 2010 IEEE International Electron Devices Meeting (IEDM) - San Francisco, CA, USA (2010.12.6-2010.12.8)] 2010 International Electron Devices Meeting - A novel cylinder-type MIM capacitor in porous low-k film (CAPL) for embedded DRAM with advanced CMOS logics

Hijioka, K., Inoue, N., Kume, I., Kawahara, J., Furutake, N., Shirai, H., Itoh, T., Ogura, T., Kazama, K., Yamamoto, Y., Kasama, Y., Katsuyama, H., Manabe, K., Yamamoto, H., Saito, S., Hase, T., Hayas

Year:

2010

Language:

english

File:

PDF, 811 KB

english, 2010

39

[IEEE IEEE International Electron Devices Meeting - San Francisco, CA, USA (8-11 Dec. 2002)] Digest. International Electron Devices Meeting, - Suppression of stress induced open failures between via and Cu wide line by inserting Ti layer under Ta/TaN barrier

Ueki, M., Hiroi, M., Ikarashi, N., Onodera, T., Furutake, N., Yoshiki, M., Hayashi, Y.

Year:

2002

Language:

english

File:

PDF, 275 KB

english, 2002

40

[IEEE 2007 IEEE International Electron Devices Meeting - Washington, DC, USA (2007.12.10-2007.12.12)] 2007 IEEE International Electron Devices Meeting - Highly Reliable Thin MIM Capacitor on Metal (CoM) Structure with Vertical Scalability for Analog/RF Applications

Inoue, N., Kume, I., Kawahara, J., Furutake, N., Toda, T., Matsui, K., Furumiya, M., Iwaki, T., Shida, S., Hayashi, Y.

Year:

2007

Language:

english

File:

PDF, 2.17 MB

english, 2007

41

[IEEE Proceedings of the IEEE 2006 International Interconnect Technology Conference - Burlingame, CA (2006.06.5-2006.06.7)] 2006 International Interconnect Technology Conference - A metallurgical prescription for electromigration (EM) reliability improvment in scaled-down, Cu dual damascene interconnects

Tada, M., Abe, M., Ohtake, H., Furutake, N., Tonegawa, T., Motoyama, K., Itos, M.K., Ueki, M., Takeuchi, T., Saito, S., Fujii, K., Sekine, M., Hayashi, Y., Tohara, M.

Year:

2006

Language:

english

File:

PDF, 771 KB

english, 2006

42

[IEEE International Electron Devices Meeting 1998. Technical Digest - San Francisco, CA, USA (6-9 Dec. 1998)] International Electron Devices Meeting 1998. Technical Digest (Cat. No.98CH36217) - Si field emitter array with 90-nm-diameter gate holes

Takemura, H., Yoshiki, M., Furutake, N., Tomihari, Y., Okamoto, A., Miyano, S.

Year:

1998

Language:

english

File:

PDF, 446 KB

english, 1998

43

[IEEE 2007 IEEE International Electron Devices Meeting - Washington, DC, USA (2007.12.10-2007.12.12)] 2007 IEEE International Electron Devices Meeting - Cost-effective and High Performance Cu Interconnects (keff=2.75) with Continuous SiOCH Stack Incorporating a Low-k Barrier Cap (k=3.1)

Ueki, M., Yamamoto, H., Ito, F., Kawahara, J., Tada, M., Takeuchi, T., Saito, S., Furutake, N., Onodera, T., Hayashi, Y.

Year:

2007

Language:

english

File:

PDF, 2.38 MB

english, 2007

44

[IEEE 9th International Vacuum Microelectronics Conference - St. Petersburg, Russia (7-12 July 1996)] 9th International Vacuum Microelectronics Conference - A fully-LSI-process-compatible Si field emitter technology with high controllability of emitter height and sharpness

Takemura, H., Furutake, N., Nisimura, M., Tsuida, S., Yoshiki, M., Okamoto, A., Miyano, S.

Year:

1996

Language:

english

File:

PDF, 328 KB

english, 1996

45

[IEEE 2011 IEEE International Electron Devices Meeting (IEDM) - Washington, DC, USA (2011.12.5-2011.12.7)] 2011 International Electron Devices Meeting - Highly reliable BEOL-transistor with oxygen-controlled InGaZnO and Gate/Drain offset design for high/low voltage bridging I/O operations

Kaneko, K., Inoue, N., Saito, S., Furutake, N., Sunamura, H., Kawahara, J., Hane, M., Hayashi, Y.

Year:

2011

Language:

english

File:

PDF, 661 KB

english, 2011

46

[IEEE 2007 IEEE International Interconnect Technology Conferencee - Burlingame, CA, USA (2007.06.4-2007.06.6)] 2007 IEEE International Interconnect Technology Conferencee - Highly-oriented PVD Ruthenium Liner for Low-resistance Direct-plated Cu Interconnects

Abe, M., Ueki, M., Tada, M., Onodera, T., Furutake, N., Shimura, K., Saito, S., Hayashi, Y.

Year:

2007

Language:

english

File:

PDF, 580 KB

english, 2007

47

Effects of Low-$k$ Stack Structure on Performance of Complementary Metal Oxide Semiconductor Devices and Chip Package Interaction Failure

Tagami, Masayoshi, Inoue, Naoya, Ueki, Makoto, Narihiro, Mitsuru, Tada, Munehiro, Yamamoto, Hironori, Ito, Fuminori, Furutake, Naoya, Saito, Shinobu, Onodera, Takahiro, Takeuchi, Tsuneo, Hayashi, Yosh

Journal:

Japanese Journal of Applied Physics

Year:

2012

Language:

english

File:

PDF, 2.09 MB

english, 2012

48

Improvement of Uniformity and Reliability of Scaled-Down Cu Interconnects with Carbon-Rich Low- k Films

Kume, Ippei, Ueki, Makoto, Inoue, Naoya, Kawahara, Jun, Ikarashi, Nobuyuki, Furutake, Naoya, Saitoh, Shinobu, Hayashi, Yoshihiro

Journal:

Japanese Journal of Applied Physics

Year:

2011

Language:

english

File:

PDF, 297 KB

english, 2011

49

Artery Fistula Causing Aortic Regurgitation in Pulmonary Atresia With Ventricular Septal Defect and Major Aortopulmonary Collateral Arteries

Furutake, Tatsuya, Koizumi, Junichi, Iwase, Tomoyuki, Kamada, Takeshi, Takahashi, Shin, Oyama, Kotaro, Okabayashi, Hitoshi, Ikai, Akio

Journal:

The Annals of Thoracic Surgery

Year:

2015

Language:

english

File:

PDF, 573 KB

english, 2015

50

Nano-Structural Control of Molecular-Pore Stacked (MPS) SiOCH Films Using Plasma Copolymerization Reaction

Yamamoto, Hironori, Ito, Fuminori, Tada, Munehiro, Takeuchi, Tsuneo, Furutake, Naoya, Hayashi, Yoshihiro

Journal:

MRS Proceedings

Year:

2006

Language:

english

File:

PDF, 391 KB

english, 2006

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